发明名称 |
Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures |
摘要 |
A method for producing printed circuit boards having coarse conductor structures and at least one region having fine conductor structures. The coarse conductor structures and the fine conductor structures are etched out of a metal layer in a common etching process. An etching resist patterned by means of photolithography is used in the region of the coarse conductor structures, and an etching resist patterned with the aid of a laser beam is used in the region of the fine conductor structures.
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申请公布号 |
US6627091(B1) |
申请公布日期 |
2003.09.30 |
申请号 |
US20010743567 |
申请日期 |
2001.01.10 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
VAN PUYMBROECK JOZEF |
分类号 |
H05K1/02;H05K3/00;H05K3/02;H05K3/06;H05K3/10;H05K3/42;(IPC1-7):H05K3/06 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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