| 摘要 |
Capacitance sensor electrodes (22) are arranged in a form of matrix on a semiconductor substrate (10) and coated with a cover film (23). These capacitance sensor electrodes (22) are connected to a drive circuit (11). ESD electrodes (21) are arranged in the vicinities of corner portions of the capacitance sensor electrodes (22). Each ESD electrode (21) is composed of a film containing, for example, aluminum excellent in conductivity and a TiN film formed thereon. The ESD electrodes (21) are grounded through the semiconductor substrate (10). On each ESD electrode (21), a plurality of fine ESD holes reaching the ESD electrode (21) from a surface of the cover film (23) are formed.
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