| 发明名称 |
Copper powder for electroconductive paste excellent in resistance to oxidation and method for preparation thereof |
| 摘要 |
A highly oxidation-resistant copper powder for conductive paste, which is a copper powder containing not more than 5 wt % of Si, is characterized in that substantially all of the Si is adhered to the surfaces of the copper particles as SiO2-system gel coating film. |
| 申请公布号 |
US2003178604(A1) |
申请公布日期 |
2003.09.25 |
| 申请号 |
US20030311884 |
申请日期 |
2003.05.08 |
| 申请人 |
OKADA YOSHIHIRO;EBARA ATSUSHI |
发明人 |
OKADA YOSHIHIRO;EBARA ATSUSHI |
| 分类号 |
B22F1/02;H01B1/02;(IPC1-7):H01B1/00 |
主分类号 |
B22F1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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