| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for precision molding parts with improved moldability and dimensional stability. SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent, a filler and a silicon a compound shown by a molecular structure of formula (I) (wherein R<SP>1</SP>-R<SP>4</SP>are each voluntarily selected from methyl and phenyl groups, m and n are integers). The filler is contained in the epoxy resin composition at 80 wt.% or above. COPYRIGHT: (C)2003,JPO
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