MOUNTING STATE INSPECTION METHOD AND MOUNTING STATE INSPECTION SYSTEM FOR ELECTRONIC ELEMENT

摘要

PROBLEM TO BE SOLVED: To widely observe a press-bonded state of conductive particles of an anisotropic conductive film, deformation of an electrode pad of a mounting board and bumps of a semiconductor element, and the influence of aging effect on the press-bonded state. SOLUTION: In this inspection method of the mounted state of an electronic element wherein electronic elements such as a semiconductor element IC and a circuit board F are mounted on the electrode pads 2 of a transparent mounting board 1 by thermocompression bonding through the anisotropic conductive film 6 including the conductive particles 6a, an upheaval state 2a of each press- bonding position of the conductive particles 6a with respect to the electrode pad 2 of the mounting board 1 is observed through the transparent mounting board 1 with a differential interference microscope 21. COPYRIGHT: (C)2003,JPO