| 发明名称 |
Solid conductive element insertion apparatus |
| 摘要 |
An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
|
| 申请公布号 |
US2003178471(A1) |
申请公布日期 |
2003.09.25 |
| 申请号 |
US20020102129 |
申请日期 |
2002.03.20 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HALL RICHARD R.;LIN HOW T.;MAJKA CHRISTOPHER J.;SEWARD MATTHEW F.;SMITH RONALD V. |
| 分类号 |
B23K1/20;H01L21/48;H05K3/40;(IPC1-7):B23K1/20;B23K20/14;B23K35/12 |
主分类号 |
B23K1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
