MOLD RELEASE LAYER TRANSFERRING FILM AND LAMINATE FILM

摘要

A mold release layer transferring film which can easily form a mold release layer on a COF-use flexible printed wiring board, does not permit an insulation layer to be fused to a heating tool, and can enhance the reliability and productivity of a semiconductor chip mounting line. A mold release layer transferring film (1) for forming a mold release layer on an insulation layer constituting a COF-use flexible printed wiring board, comprising a transferring film (2) and a transferring mold release layer (3) provided on one surface of the transferring film (2), the transferring mold release layer (3) being formed of a mold release agent and transferable to an insulation layer.