发明名称 |
DEVICE FOR SOLDERING CONTACTS ON SEMICONDUCTOR CHIPS |
摘要 |
According to the invention, a chip (4), maintained on a chip support (13) by means of a mandrel (1) is heated by a radiation source (12) on the side opposite to the wafer (2) so as to melt an input soldering metal applied on one side opposite to the wafer. A cleaning device (5) comprising a plate (6) provided with a slot (7), a gas channel (8) and a gas evacuation port (14) located proximate to the slot and designed for a forming gas is placed parallel to the wafer. The chip is moved vertically relative to the wafer, compressed on the wafer through the slot and soldered by isothermal solidification. |
申请公布号 |
WO03030246(A3) |
申请公布日期 |
2003.09.18 |
申请号 |
WO2002DE03506 |
申请日期 |
2002.09.19 |
申请人 |
INFINEON TECHNOLOGIES AG;BERGMANN, ROBERT;HUEBNER, HOLGER |
发明人 |
BERGMANN, ROBERT;HUEBNER, HOLGER |
分类号 |
B23K1/00;B23K1/005;B23K1/008;B23K1/012;B23K3/08;F24C7/00;F26B19/00;H01L21/00;H01L21/58;H01L21/60;H01L21/603;H05K3/34;H05K13/04 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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