发明名称 Drainage structure in polishing plant
摘要 Disclosed is a polishing plant comprising a polishing apparatus (30) having a top ring (35) for holding a workpiece and a turn table (33) for polishing a surface of the workpiece held by the top ring; and a cleaning apparatus (50) having cleaning machines for cleaning the workpiece polished by the polishing apparatus (30), wherein at least one drainage pipe connected to the polishing apparatus to discharge a waste liquid from the polishing apparatus and at least one drainage pipe connected to the cleaning apparatus (5) to discharge a waste liquid from the cleaning apparatus are divided into a plurality of drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, a waste liquid treatment can be efficiently conducted.
申请公布号 EP1325793(A3) 申请公布日期 2003.09.17
申请号 EP20030004216 申请日期 1997.11.13
申请人 EBARA CORPORATION 发明人 TOGAWA, TETSUJI;YAMAGUCHI, KUNIAKI
分类号 B24B37/04;B24B57/00;H01L21/00 主分类号 B24B37/04
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