| 摘要 |
<p>A grasping side contact arm (317) holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera (326) of an alignment apparatus (320). The IC to be tested is inserted into a first opening (321a) formed in alignment movable portion (321) and an abutment member (317d) of the grasping side contact arm (317) is brought into abutment with the alignment movable portion (321). The camera (326) picks up image of the IC to be tested and performs image processing so as to calculate an alignment amount for correcting the position of the IC to be tested. Lock and free means (318) provided in a first contact arm (315a1) is put into a non-restriction state and according to the alignment amount, a movable drive apparatus (322) is driven. The grasping side contact arm (317) in abutment with the alignment movable portion (321) is moved with respect to a fundament side contact arm (316). Thus, the position of the IC to be tested is aligned.</p> |
