Component and method for producing a component

摘要

A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.

主权项

1. A method for producing a component comprising a substrate, a chip and a frame, the method comprising:
applying the frame to the substrate; connecting the chip to the frame in such a way that the chip bears on the frame; and hermetically sealing the connection between the chip and the frame by a sealing layer, wherein the sealing layer is applied by inkjet printing in a positionally accurate manner directly between the frame and the chip after the chip has been connected to the frame, and wherein applying the sealing layer by inkjet printing is effected in sections, one section comprising only a polymer and one section comprising only metal particles.