GASTIGHT BONDING STRUCTURE BETWEEN CERAMIC AND METAL AND INSTRUMENT PART HAVING THE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a gastight bonding structure between a ceramic and a metal that is capable of bonding in a gastight state between a large ceramic component and the metal even in the portion which is exposed to a high temperature such as higher than 200°C at which the normal O-ring can not endure. SOLUTION: The gastight bonding structure between ceramics and the metal is bonded in the gastight state by filling the space between both plane surfaces of the metal plate and a ditch with a glass 3 in which one end of the metal plate such as a W-ring 2 is inserted in the ditch formed from a pipe A and a pipe B of the ceramics. The difference of thermal expansion coefficients between the ceramics and the glass is 5×10-6/°C or less. The gastight bonding structure is applicable to a large type instrument parts such as a part used in a chamber of a semiconductor manufacturing instrument or a liquid crystal manufacturing instrument. COPYRIGHT: (C)2003,JPO