GAS INJECTOR AND COVER PLATE ASSEMBLY FOR SEMICONDUCTOR EQUIPMENT

摘要

The invention provides a gas injector and cover plate assembly comprising a cover plate, a gas injector and a ceiling. The cover plate comprises a plurality of cooling fluid channels. The gas injector is configured to be located on the cover plate comprising a gas distributor, a fluid-cooling gas transmitter, a plurality of gas spraying plates and a conducting cone. The gas distributor distributes a plurality of gases and a gas transmitter cooling fluid. The gas distributor comprises a gas conduit for introducing a first gas. The fluid-cooling gas transmitter connects the gas distributor to introduce the gas transmitter cooling fluid to form a plurality of cooling fluid walls and the first gas and the gases. The gas spraying plates and the conducting cone are located beneath the fluid-cooling gas transmitter.

主权项

1. A gas injector and cover plate assembly for a process system with a process space, comprising:
a cover plate comprising a plurality of cooling fluid channels for introducing a plurality of cooling fluids with different temperatures to form a temperature gradient; and a gas injector attached to the cover plate located above the process space, comprising:
a gas distributor uniformly distributing a plurality of gases, the gas distributor comprising a gas conduit through the gas distributor for introducing a first gas;a fluid-cooling gas transmitter connecting the gas distributor comprising:
a plurality of independent channels for introducing the cooling fluids to form a plurality of cooling fluid walls;a first gas channel connecting the gas conduit; anda plurality of gas channels for introducing the gases;wherein the independent channels being between the two adjacent gas channels, and outside the gas channels; anda plurality of gas spraying plates and a conducting cone being sequentially located beneath the fluid-cooling gas transmitter, the two adjacent gas spraying plates changing a flow direction of one of the gases, and the gas spraying plate and the conducting cone changing a flow direction of the first gas.