| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame which can be easily cut, and a cutting method therefor in cutting the lead frame by laser beam irradiation. <P>SOLUTION: A semiconductor chip is mounted on a lead frame formed by repeatedly arranging a plurality of combinations each consisting of at least a plurality of leads to be used as terminals of the individual semiconductor device and integrally molding the leads by a metal plate provided with a frame portion for a connecting the leads, the resulted product is sealed with a resin, and separated into individual semiconductor devices. In this case, the portion coated with Ag where the leads are to be cut is cut by irradiating the portion with a laser beam of 300 nm-320 nm in wavelength. <P>COPYRIGHT: (C)2003,JPO</p> |
