| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in curability at moisture absorption, flow property, and reflow crack resistance and to provide electronic part devices equipped with elements sealed with this epoxy resin composition. SOLUTION: The composition comprises, as essential components, (A) an epoxy resin containing a sulfur atom, (B) a phenolic resin, and (C) an addition product of a phosphine compound in which at least one alkyl group is bonded to the phosphorous atom and a quinone compound. There is also provided the electronic part devices equipped with the elements sealed with this epoxy resin composition. COPYRIGHT: (C)2003,JPO
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