发明名称 COOLING DEVICE AND COOLING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To efficiently cool a heat generating source such as an electronic component by using natural convection. <P>SOLUTION: This device is provided with a fluid path 30 which is extensively provided in a casing 28 and has an external surface 32, an internal surface 34, an inlet port 40 and an exhaust port 42, a fluid medium 36 which is housed in the path 30, and a thermal conductive member which is disposed so as to be adjacent to an electronic component 24 generating heat, is thermal- conductively connected to the component 24 at the external surface, is thermal- conductively disposed on the path 30 and maintains a temperature difference between the component 24 and the path 30. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249612(A) 申请公布日期 2003.09.05
申请号 JP20020343011 申请日期 2002.11.26
申请人 SONY CORP;BAR-COHEN AVRAM 发明人 YAZAWA KAZUAKI;BAR-COHEN AVRAM
分类号 F25D1/00;F01K25/14;F03D11/04;F03G7/00;F03G7/10;H01L23/36;H01L23/467;H05K7/20 主分类号 F25D1/00
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