发明名称 |
Semiconductor device with shock absorbing bond pad |
摘要 |
A semiconductor device includes a substrate; a metal layer formed on the substrate; an insulating layer, which is formed on the metal layer and is provided with a via-hole through it; and a bonding pad formed above the via-hole. The bonding pad comprises an inner portion arranged in the via-hole and an outer portion arranged above the via-hole. The boding pad is made of a conductive resin having a shock absorbing characteristic.
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申请公布号 |
US6614112(B2) |
申请公布日期 |
2003.09.02 |
申请号 |
US20020109727 |
申请日期 |
2002.04.01 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
UCHIDA YASUFUMI |
分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L23/485;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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