发明名称 |
BMUPING PROCESS |
摘要 |
A bumping process wherein a substrate is first provided with many electrical connections. Subsequently, the bumps on the bump transfer substrate are pressed onto the electrical connections of the substrate accompanying a heating process and then the bumps are transferred onto the electrical connections of the substrate because the adhesion characteristic between the bumps and the electrical connections is better than that between the bumps and the release layer.
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申请公布号 |
US2003162321(A1) |
申请公布日期 |
2003.08.28 |
申请号 |
US20020248227 |
申请日期 |
2002.12.30 |
申请人 |
TONG HO-MING;LEE CHUN-CHI;FANG JEN-KUANG;HUANG MIN-LUNG;CHEN JAU-SHOUNG;SU CHING-HUEI;WENG CHAO-FU;LEE YUNG-CHI;CHOU YU-CHEN;WU TSUNG-HUA;TAO SU |
发明人 |
TONG HO-MING;LEE CHUN-CHI;FANG JEN-KUANG;HUANG MIN-LUNG;CHEN JAU-SHOUNG;SU CHING-HUEI;WENG CHAO-FU;LEE YUNG-CHI;CHOU YU-CHEN;WU TSUNG-HUA;TAO SU |
分类号 |
H01L21/48;H01L21/60;H01L21/68;H05K3/40;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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