| 摘要 |
The invention pertains to a chip module 20 and a method for producing a chip card module that comprises a chip module with a chip carrier 21 and a chip 22 that is contacted with strip conductors 25, 26 of the chip carrier, wherein the chip carrier comprises a flexible carrier material and the strip conductors respectively extend over the length of the carrier substrate, and wherein the chip carrier 21 contains two longitudinal regions 35, 36 of identical length which are offset relative to one another in the longitudinal direction of the chip carrier and respectively assigned to one strip conductor 25, 26. |
