| 发明名称 |
Semiconductor module and method of making the device |
| 摘要 |
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.
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| 申请公布号 |
US6610934(B2) |
申请公布日期 |
2003.08.26 |
| 申请号 |
US20010995772 |
申请日期 |
2001.11.29 |
| 申请人 |
HITACHI, LTD. |
发明人 |
YAMAGUCHI YOSHIHIDE;TERABAYASHI TAKAO;TENMEI HIROYUKI;HOZOJI HIROSHI;KANDA NAOYA |
| 分类号 |
H01L25/18;H01L21/48;H01L23/14;H01L23/498;H01L23/52;H01L23/538;H01L25/04;H05K1/02;H05K1/03;H05K1/11;H05K3/00;H05K3/46;(IPC1-7):H01R12/04 |
主分类号 |
H01L25/18 |
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