| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To give good laser processing characteristics to an insulative resin composite for sealing available to a wiring board incorporating an electronic component. <P>SOLUTION: In an insulative resin composite composed of a nonconductive filler dispersed in a thermosetting material, an average particle size of the nonconductive filter sued is 0.3-20μm and the ratio of the insulative filler of 64μm or over in size included in the total nonconductive filler is 5.0 weight percent or below. The insulative resin composite preferably does not include silicone oil so as to improve its platability. The wiring board incorporating an electric component which uses the insulative resin composite comprises a first wring substrate 3 which includes a first wiring 2 formed on at least one side of a first substrate 1, an electric part 4 connected to the first wiring 2 of the first wiring substrate 3, an insulation layer 5 for sealing the electric component 4, a second wring substrate 8 which includes a second wiring 7 formed on at least one side of a second substrate 6 provided on the insulation layer 5, and via hole 9 for connecting the first wiring 2 and second wiring 7. <P>COPYRIGHT: (C)2003,JPO</p> |
