发明名称 MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated ceramic electronic component provided with a process for surely and stably sucking and holding a ceramic green sheet on an under face of a suction head when the ceramic green sheet is sucked on the under face of the suction head for being released from a carrier film. SOLUTION: The manufacturing method of the laminated ceramic electronic components is provided with; a process for arranging the ceramic green sheet 2 supported by the carrier film 1 on a table 3; a process for sucking the ceramic green sheet 2 on the under face 4a of the suction head 4 by arranging the suction head 4 so as to be spaced with a gap T from an upper face of the ceramic green sheet 2 and being sucked by a suction hole 4b of the suction head 4; a process for cutting the ceramic green sheet 2 by a cutting blade 5; and a process for sucking and holding the cut ceramic green sheet on the under face 4a of the suction head 4 and separating it from the carrier film 1. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003234243(A) 申请公布日期 2003.08.22
申请号 JP20020029887 申请日期 2002.02.06
申请人 MURATA MFG CO LTD 发明人 KAWABATA AKIHIRO
分类号 H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/30
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