发明名称 |
SOLDERING APPARATUS FOR COLLIMATOR |
摘要 |
PURPOSE: A soldering apparatus for collimator are provided to enhance the manufacturing efficiency and improve the productivity by improving a structure of the soldering apparatus. CONSTITUTION: A soldering apparatus for collimator includes a solder portion(30), a soldering bar(32), and a heating portion(34). The solder portion is arranged nearly to a couple of through-holes(20a,20b) which are formed along a longitudinal direction of a housing(20). The soldering bar is arranged between a couple of collimators(10,10') and the housing. The heating portion heats the soldering bar. The soldering apparatus for collimator further includes a control portion to control a charge of the soldering portion. The heating portion is formed with a lamp which uses Xenon as energy source.
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申请公布号 |
KR20030068275(A) |
申请公布日期 |
2003.08.21 |
申请号 |
KR20020007985 |
申请日期 |
2002.02.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, MYEON SUN;KIM, BYEONG GON;SUN, HONG SEOK |
分类号 |
G02B27/30;(IPC1-7):G02B27/30 |
主分类号 |
G02B27/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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