| 摘要 |
FIELD: power electronics. SUBSTANCE: semiconductor power module has easily changeable sub-modules enclosed in shell and designed to readily take power and heat loads. Sub-modules have sandwich structure of ceramic substrate, one or more semiconductor power chips, and molybdenum disk, and they are potted in plastic material. Sub-modules are secured at points of their installation on common plate of base and come in contact by means of piled set of conductors. Sub-modules are secured and brought in convertible contact by means of hold-down contacts. EFFECT: simplified design, enhanced flexibility and strength of modules. 8 cl, 3 dwg |
