发明名称 Wire bonding apparatus
摘要 There is provided a wire bonding apparatus operated steadily at a high speed without excitation of vibrations of an XY stage 102 and a capillary 104, which are movable parts. The wire bonding apparatus is configured so as to have a composite target path generating section 208 for generating a target path 109, in which the deceleration part of a go path and the acceleration part of a return path are composed to one continuous path, for a path part of reciprocating movement of said target path indicating a motion process of either one or both of the XY stage and capillary.
申请公布号 US6607112(B2) 申请公布日期 2003.08.19
申请号 US20010919860 申请日期 2001.08.02
申请人 NEC CORPORATION 发明人 TODA YASUSHI
分类号 H01L21/60;B23K20/00;H01L21/00;(IPC1-7):B23K1/06 主分类号 H01L21/60
代理机构 代理人
主权项
地址
您可能感兴趣的专利