发明名称 |
Method of making a multi-layer interconnect |
摘要 |
Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good cells are removed from the panels, and new panels created entirely of identified/known good cells allow increases in the number of layers used in a HDI without incurring the decrease in yield normally associated with such a layering process.
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申请公布号 |
US6607939(B2) |
申请公布日期 |
2003.08.19 |
申请号 |
US20010028261 |
申请日期 |
2001.12.18 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
POMMER RICHARD;MCELREA SIMON;BANISTER BRAD |
分类号 |
H01L21/48;H01L21/66;H01L23/498;H01L23/538;H05K1/02;H05K1/14;H05K3/00;H05K3/22;H05K3/46;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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