| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability in the operation of each member that is mounted on a lead frame, and at the same time to miniaturize an optic element integrating apparatus. <P>SOLUTION: A light-emitting device 12, a light receiving element 16, a first IC 13 for drive for the light-emitting device, and a second IC 17 for drive for the light receiving element are mounted to a metallic lead frame 9. The light- emitting device is mounted on a first mounting surface 10a of the lead frame. The light receiving element is mounted onto a second mounting surface 10c opposite to the first mounting surface of the lead frame. <P>COPYRIGHT: (C)2003,JPO</p> |
