发明名称 CURABLE ADHESIVE AND METHOD OF BONDING WITH THE SAME
摘要 <p>An excellent adhesive which is excellent in surface-drying properties during cold setting and in such tenacious adhesion that no peeling occurs at the interface between an adherend and the adhesive and the curability of which is not influenced by moisture or water content of the adherend; and a method of bonding a fiber-reinforced plastic with the adhesive. The adhesive is a curable adhesive which comprises (A) a urethane resin having polymerizable unsaturated groups, (B) a resin having polymerizable unsaturated groups which is dryable with air, (C) an unsaturated monomer having a (meth)acryloyl group, (D) a coupling agent, and (E) a filler, and gives a cured article having a tensile elongation of 1 to 33%. The bonding method comprises the step of bonding a fiber-reinforced plastic molding with the curable adhesive.</p>
申请公布号 WO2003066772(P1) 申请公布日期 2003.08.14
申请号 JP2003001323 申请日期 2003.02.07
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