发明名称 |
Surface-treated copper foil and method for producing the same |
摘要 |
The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.
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申请公布号 |
US6605369(B1) |
申请公布日期 |
2003.08.12 |
申请号 |
US20010913775 |
申请日期 |
2001.08.14 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
TAKAHASHI NAOTOMI;HIRASAWA YUTAKA |
分类号 |
B32B15/08;C23F15/00;C25D5/10;C25D5/48;C25D11/38;H05K1/09;H05K3/38;(IPC1-7):B32B15/04;C25D5/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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