| 发明名称 |
HIGH FREQUENCY CIRCUIT PACKAGE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem in a prior art high frequency circuit package that an electromagnetic wave radiated from a high frequency circuit 8 is fed back to the input thereof thus easily causing unnecessary oscillation in the high frequency circuit. <P>SOLUTION: The high frequency circuit package having a part 12 for mounting a high frequency circuit 8 is provided with a part mixed with an electromagnetic wave absorbing material and absorbing the electromagnetic wave in the working frequency band of the high frequency circuit 8. <P>COPYRIGHT: (C)2003,JPO |
| 申请公布号 |
JP2003224218(A) |
申请公布日期 |
2003.08.08 |
| 申请号 |
JP20020019618 |
申请日期 |
2002.01.29 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
IYAMA YOSHITADA;TOMIYAMA KENICHI |
| 分类号 |
H01L23/02;H01P1/00;H01P3/08 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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