| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a large quantity of glass component is deposited on the surface of a wiring conductor to block wire bonding or the mounting of a semiconductor element, a chip component, and the like. SOLUTION: A wiring conductor comprising a first conductor layer 2 containing 100 pts.wt. of Ag-Pd and 1-5 pts.wt. of glass, and a second conductor layer 3 formed on the first conductor layer 2 and containing 100 pts.wt. of Ag-Pd and 0.1-0.5 pts.wt. of glass is formed on the surface of a glass ceramic insulating substrate 1, thus forming a glass ceramic wiring substrate. Defects of appearance, e.g. the deposition of glass on the surface of the wiring conductor, swelling, bubbling, and the like, are suppressed and good wire bonding performances or good mounting performances of a semiconductor element, a chip component, and the like, are attained. Furthermore, the shrinking behavior of the glass ceramic insulating substrate 1 and the wiring conductor can be matched at the time of firing and the wiring conductor can be formed with sufficient bonding strength. COPYRIGHT: (C)2003,JPO
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