| 摘要 |
PROBLEM TO BE SOLVED: To provide a light and inexpensive cooling device for electronic equipment, which is mounted on electronic equipment, radiates and cools heat that electronic equipment generates and has improved workability. SOLUTION: The device is provided with a heat sink which is thermally connected to electronic equipment being a heat generating source, a blower fan cooling the heat sink and a fan case which stores the fan and which is thermally connected to the heat sink. The cooling device is mounted on electronic equipment. At least one member selected from the heat sink, the blade of the fan and the fan case is constituted of a thermo conductive resin mold where 30 to 70% by volume of a high thermo conductive filler is dispersed in a thermoplastic resin matrix based on the whole volume of the mold. COPYRIGHT: (C)2003,JPO
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