发明名称 INTER-SUBSTRATE CONNECTION FITTING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an inter-substrate connection fitting of simple constitution, wherein a contact area between mutual connecting parts is enabled to be sufficiently secured, and wherein connection/separation is enabled between the substrates easily and surely. <P>SOLUTION: The inter-substrate connection fitting which connects one substrate and the other substrate is made to have a constitution comprising the first terminal 3 installed at one of the substrate 1, the second terminal 4 installed at the other substrate 2, and a connection bar 6 enabled to be connected with and separated from these first and second terminals 3, 4, of which the first terminal 3 has a spring property, with a contact part 3d folded and formed nearly in a V-shape at one side, and a contact part 3e folded and formed nearly in a V-shape at the other side, the second terminal 4 also has similar contact parts 4d, 4e, and the connection bar 6 has a plate-like connecting plate 6a in which one end part is enabled to be inserted and pinched between the contact parts 3d, 3e of the first terminal 3, and in which the other end part is enabled to be inserted and pinched between the contact parts 4d, 4e of the second terminal 4. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003208933(A) 申请公布日期 2003.07.25
申请号 JP20020007385 申请日期 2002.01.16
申请人 TAMURA SEISAKUSHO CO LTD 发明人 AIDA MASUHISA;MATSUO SATOSHI
分类号 H01R13/658;(IPC1-7):H01R12/16 主分类号 H01R13/658
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