发明名称 Split gate flash memory cell structure and method of manufacturing the same
摘要 A non-volatile memory cell that includes a semiconductor substrate, a well region implanted with a first-type dopant formed in the semiconductor substrate, a first doped region implanted with a second-type dopant formed in the semiconductor substrate, a second doped region, formed spaced-apart from the first doped region, implanted with a second-type dopant formed in the semiconductor substrate, the second doped region further including a third region implanted with the first-type dopant, a first dielectric layer disposed over the semiconductor substrate, a floating gate disposed over the first dielectric layer and extending over the well region and a portion of the second doped region, a second dielectric layer disposed over the floating gate, and a control gate disposed over the first dielectric layer and the second dielectric layer.
申请公布号 US2003137002(A1) 申请公布日期 2003.07.24
申请号 US20030383527 申请日期 2003.03.10
申请人 WINBOND ELECTRONICS CORPORATION 发明人 HSU CHING-HSIANG;YANG EVANS CHING-SONG;LEU LEIN-YI;CHEN BIN-SHING
分类号 H01L21/28;H01L21/336;H01L29/423;H01L29/788;(IPC1-7):H01L21/336 主分类号 H01L21/28
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