A semiconductor device having a chip-size package structure comprises a semiconductor element 11 on which protruding electrodes 12 are formed. Resin is applied to positions of the semiconductor elements provided with the bumps so that a resin layer 13 seals the protruding electrodes except for end portions thereof. Connections are made to, for example, wiring boards via the end portions of the protruding electrodes as such or via formations such as external protruding connectors provided to the end portions of the protruding electrodes. <IMAGE>
