WAFER BOAT AND FURNACE AND METHOD FOR HEAT-TREATING WAFER

摘要

PROBLEM TO BE SOLVED: To provide a wafer boat that prevents the slip of semiconductor wafers by reducing the contact stresses or deflections caused by the own weights of the wafers. SOLUTION: Prescribed heat treatment is performed on the semiconductor wafers W in a state where the wafers W are caused to generate Lorentz forces in the direction opposite to the gravitational force, by generating a magnetic field around the wafer boat 13 from the outside of a furnace core pipe 2 and making an electric current to flow to an electrode portion 24. COPYRIGHT: (C)2003,JPO