发明名称 |
Circuit board and method of producing the same |
摘要 |
A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn by laser beam irradiation on the surface of the resin molded article through electroless plating, and the method of producing the same.
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申请公布号 |
US2003129371(A1) |
申请公布日期 |
2003.07.10 |
申请号 |
US20020329558 |
申请日期 |
2002.12.27 |
申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
URAKAWA TOSHIYA;SUZUKI YOUHEI;INADA KUNIHIRO;KAWANO YASUYUKI |
分类号 |
H05K1/03;H05K3/18;(IPC1-7):B32B9/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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