RESIN-CARRYING METAL FOIL FOR MULTILAYERED WIRING BOARD, PROCESS FOR MANUFACTURING THE SAME, MULTILAYERED WIRING BOARD, AND ELECTRONIC DEVICE

摘要

The invention provides resin-carrying metal foil for a multilayered wiring board which comprises metal foil having provided on one side thereof a film of a thermosetting resin having a relative dielectric constant of not higher than 3.3 at a frequency range of not lower than 1 MHz and having a resin flow of from 1 to 50% or from 5 to 50%, and a process for producing the same. The invention also provides a (successive) multilayered wiring board produced by using the resin-carrying metal foil and an electronic device comprising the multilayered wiring board and an electronic element connected thereto with a wiring means. <IMAGE>