发明名称 RESIN COMPOSITION BLENDED WITH DESICCANT, MOLDED RESIN ARTICLE THEREFROM, AND MOLDING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a resin composition blended with a desiccant that can furnish drying properties to a packaging material, a packaging container, etc., or to a content packaged by a packaging material, a packaging container, etc., to provide a molded resin article therefrom, and to provide a molding method therefor. SOLUTION: This resin composition blended with a desiccant that is obtained by mixing a base resin, a molecular sieve, and an additive having a polar group to enhance affinity between the molecular sieve and the base resin is used for preparing a molded article. The molding can be performed at a high speed at a temperature of≤300°C. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003192908(A) 申请公布日期 2003.07.09
申请号 JP20010396563 申请日期 2001.12.27
申请人 KYODO PRINTING CO LTD 发明人 OIKAWA TAKUJI;OGAWA TATSUYA;KOIZUMI SHINICHI;TAKAHASHI SAORI;FUCHITA TAIJI;FUJII HIROSHI
分类号 F26B5/16;B29C47/00;B29K101/12;B29K105/16;C08J3/20;C08J5/00;C08K7/24;C08L101/00;(IPC1-7):C08L101/00 主分类号 F26B5/16
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