发明名称 METHOD AND DEVICE FOR SPIN TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide a spin process device of which the treatment liquid jetted from a nozzle is not contaminated. SOLUTION: The spin treatment device treats a substrate with treatment liquid while the substrate is rotated. It comprises a cup, a rotating table which is, provided in the cup, rotated while holding the substrate, a nozzle 21 which jets the treatment liquid toward the substrate held on the rotating table, a supply pipe 35 which supplies the treatment liquid to the nozzle, a bypass pipe 37 comprising a throttle valve 38 which makes the treatment liquid drop from the nozzle when jetting of the treatment liquid to the substrate from the nozzle is stopped. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003188072(A) 申请公布日期 2003.07.04
申请号 JP20010383540 申请日期 2001.12.17
申请人 SHIBAURA MECHATRONICS CORP 发明人 SUEYOSHI HIDEKI
分类号 G03F7/38;H01L21/027;H01L21/304;(IPC1-7):H01L21/027 主分类号 G03F7/38
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