发明名称 Bonding apparatus
摘要 A bonding apparatus that includes a bonding tool through which a wire passes and which performs bonding on a workpiece, a position detection camera which takes images of the workpiece, a reference member which is disposed in a specified position, and an optical assembly which conducts the image of the tool and reference member to the position detection camera. A lens used in the position detection camera and a lens installed in the optical assembly are arranged so that such lenses construct an afocal optical system.
申请公布号 US2003123866(A1) 申请公布日期 2003.07.03
申请号 US20020325991 申请日期 2002.12.19
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 HAYATA SHIGERU
分类号 H01L21/60;G03B17/00;(IPC1-7):G03B17/00 主分类号 H01L21/60
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