发明名称 |
HEAT DISSIPATING COMPONENT USING HIGH CONDUCTING INSERTS |
摘要 |
A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar graphite member having high thermal conductivity along the plane of the member and having a relatively low thermal conductivity through the thickness of the member. A cavity is formed through the thickness of the member and the high conductivity insert is received in the cavity. The insert may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element. |
申请公布号 |
AU2002351166(A1) |
申请公布日期 |
2003.06.30 |
申请号 |
AU20020351166 |
申请日期 |
2002.11.27 |
申请人 |
GRAFTECH INC. |
发明人 |
GARY, G. CHEN;DANIEL, W. KRASSOWSKI |
分类号 |
F28F13/00;F28F21/02;H01L23/367;H01L23/373;(IPC1-7):F28F7/00;H05K7/20;H01L23/34 |
主分类号 |
F28F13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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