发明名称 PARTIAL FLUX APPLICATION METHOD
摘要 PROBLEM TO BE SOLVED: To solve the problems that it is insufficient and expensive in the case of use in partial soldering of a printed wiring board since a flux is applied while swinging an atomizing nozzle in a direction crossing a carrying direction after positioning the printed wiring board in a conventional partial flux application method. SOLUTION: The printed wiring board 10 is tact-carried and positioned. Also, the flux 8 is applied by swinging a nozzle 5 for atomization only in a long side direction x of the printed wiring board 10 through a selector 6 having an opening 5a and an application amount of the flux is controlled by the number of times of swinging. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179336(A) 申请公布日期 2003.06.27
申请号 JP20010376752 申请日期 2001.12.11
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 KONDO KENJI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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