发明名称 DEVICE AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a device and method for cleaning a semiconductor substrate and a method for manufacturing the semiconductor substrate capable of restricting a reduction in a production yield of the semiconductor substrate. SOLUTION: A semiconductor substrate cleaning device comprises a holding member 2 for holding a semiconductor substrate 1, and cleaning members 3, 4 for supplying a cleaning medium 5 only to part 6 of a surface of the semiconductor substrate 1 in a state that the semiconductor substrate 1 held by the holding member 2 is fixed. By so doing, as the cleaning medium 5 is supplied to the semiconductor substrate 1 in a state that the semiconductor substrate 1 is fixed without rotating, only the part 6 of the surface of the semiconductor substrate 1 can be cleaned. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003173999(A) 申请公布日期 2003.06.20
申请号 JP20010373912 申请日期 2001.12.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 ANABUKI KAZUTOSHI;TANAKA HIROSHI;YOKOI NAOKI;AZUMA MASAHIKO
分类号 H01L21/304;H01L21/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
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