| 发明名称 |
SUBSTRATE FOR AN ELECTRIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
| 摘要 |
The aim of the invention is to use a slow dissolving ceramic substrate for components mounted according to the Flip-Clip method, particularly surface wave components, whereby multi-layered metallisations are optionally produced thereon by metal deposition. The bumps can also be produced by self-adjusting metal deposition. |
| 申请公布号 |
WO02061833(A3) |
申请公布日期 |
2003.06.19 |
| 申请号 |
WO2002DE00180 |
申请日期 |
2002.01.21 |
| 申请人 |
EPCOS AG;FEIERTAG, GREGOR;STELZL, ALOIS;KRUEGER, HANS |
发明人 |
FEIERTAG, GREGOR;STELZL, ALOIS;KRUEGER, HANS |
| 分类号 |
H01L23/12;H01L21/60;H01L23/498;H03H3/08;H03H9/10;H03H9/145;H03H9/25;H05K1/03;H05K1/11 |
主分类号 |
H01L23/12 |
| 代理机构 |
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