发明名称 IC CHIP SEALING PART AND IC CHIP MOUNTED MEDIA HAVING IC CHIP SEALING PART
摘要 <P>PROBLEM TO BE SOLVED: To provide an IC chip sealing part which can seal an IC chip firmly by means of sealing agent and an IC chip mounted media having the IC chip sealing part. <P>SOLUTION: In an IC chip sealing part, a number of projection parts are formed in a sealing surface of an IC chip by means of sealing agent. If sealing agent is applied thereon for sealing an IC chip, a contact area between sealing agent, and a base material and a projection part is enlarged, thus enabling firm sealing of an IC chip by means of sealing agent. If the member forming a conductive circuit conductively connected to an IC chip and a member forming the projection part are the same member, labor can be saved and the cost can be reduced, which is preferable for manufacturing. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003168767(A) 申请公布日期 2003.06.13
申请号 JP20010367513 申请日期 2001.11.30
申请人 TOPPAN FORMS CO LTD 发明人 MARUYAMA TORU;NAOI SHINGO
分类号 B42D15/10;G06K19/07;G06K19/077;H01L23/28 主分类号 B42D15/10
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