发明名称 |
Radio frequency module and method for manufacturing the same |
摘要 |
A rectangular penetration hole is formed opening in the opposite two main surfaces of a first dielectric substrate. Conductors for grounding are respectively formed on the main surfaces, to cover the openings of the penetration hole. A conductor layer is formed on opposite inner walls in the penetration hole of the dielectric substrate. A waveguide is structured by a space surrounded by the conductors and the conductor layers. The waveguide is magnetically coupled with an input/output line on a second dielectric substrate through a coupling slot. Because a waveguide has walls made continuous in the dielectric substrate, a low-loss waveguide can be realized. Hence, a high-performance radio frequency module can be realized.
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申请公布号 |
US2003107459(A1) |
申请公布日期 |
2003.06.12 |
申请号 |
US20020282696 |
申请日期 |
2002.10.28 |
申请人 |
TAKAHASHI KAZUAKI;FUJITA SUGURU;OGURA HIROSHI |
发明人 |
TAKAHASHI KAZUAKI;FUJITA SUGURU;OGURA HIROSHI |
分类号 |
H01L23/12;H01P1/207;H01P1/208;H01P3/12;H01P5/107;H01P11/00;(IPC1-7):H01P1/208 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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