发明名称 Radio frequency module and method for manufacturing the same
摘要 A rectangular penetration hole is formed opening in the opposite two main surfaces of a first dielectric substrate. Conductors for grounding are respectively formed on the main surfaces, to cover the openings of the penetration hole. A conductor layer is formed on opposite inner walls in the penetration hole of the dielectric substrate. A waveguide is structured by a space surrounded by the conductors and the conductor layers. The waveguide is magnetically coupled with an input/output line on a second dielectric substrate through a coupling slot. Because a waveguide has walls made continuous in the dielectric substrate, a low-loss waveguide can be realized. Hence, a high-performance radio frequency module can be realized.
申请公布号 US2003107459(A1) 申请公布日期 2003.06.12
申请号 US20020282696 申请日期 2002.10.28
申请人 TAKAHASHI KAZUAKI;FUJITA SUGURU;OGURA HIROSHI 发明人 TAKAHASHI KAZUAKI;FUJITA SUGURU;OGURA HIROSHI
分类号 H01L23/12;H01P1/207;H01P1/208;H01P3/12;H01P5/107;H01P11/00;(IPC1-7):H01P1/208 主分类号 H01L23/12
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