| 摘要 |
The prevent invention provides a substrate processing apparatus and a substrate processing method which can process hydrophobic wafers with a fluid mixing nozzle. The substrate processing apparatus comprises processing liquid supply means 66 for supplying a processing liquid, inert gas supply means 67 for supplying an inert gas, and a fluid mixing nozzle 65 for mixing the processing liquid with the inert gas to eject the mixed processing liquid to the substrate, whereby the substrate is processed with the processing liquid, in which the inert gas supply means 67 comprises liquid mixing means 97b for mixing a fluid, IPA, for lowering surface tension of the processing liquid, and the inert gas.
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