发明名称 Multilayer build-up wiring board
摘要 Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 mum. The reason is as follows. If the diameter of the mesh hole is less than 75 mum, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 mum, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 mum. The reason is as follows. If the distance is less than 100 mum, the solid layer cannot function. If the distance exceeds 2000 mum, the deterioration of the insulating properties of the interlayer resin insulating film occurs.
申请公布号 US2003102151(A1) 申请公布日期 2003.06.05
申请号 US20020334062 申请日期 2002.12.31
申请人 发明人 HIROSE NAOHIRO;EN HONJIN
分类号 H05K1/02;H05K3/06;H05K3/24;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K1/09 主分类号 H05K1/02
代理机构 代理人
主权项
地址