发明名称 Telescoping platform assembly for packaging systems
摘要 A packaging system (1) includes a telescoping platform assembly (100) having a guide mount (30) and an extension platform (40). The packaging system (1) incorporating the telescoping platform assembly (100) includes a panel (22) and a flap member (26). The flap member (26) is connected to the panel (22) along a pivot axis (27) and is adapted to move between a first position with respect to the panel (22) and a second position with respect to the panel (22). The guide mount (30) includes a guide mount slot (33) whereas the flap member (26) includes a flap guide slot (28) extending outwardly from the pivot axis (27) through the flap member (26). The extension platform (40) is mounted on the guide mount (30) and the flap member (26) and is adapted to slide between a stowed position and a deployed position along guide mount slot (33) and the flap guide slot (28). In the deployed position, the extension platform (40) extends over an outer edge (26c) of the flap member (26) to increase the effective length of the flap member (26).
申请公布号 US6569073(B1) 申请公布日期 2003.05.27
申请号 US20000666506 申请日期 2000.09.20
申请人 DELL PRODUCTS, L.P. 发明人 BRIDGES JOHN WILLIAM;MANUEL JAMES EDWIN
分类号 B65B5/10;B65D85/68;(IPC1-7):B31B1/50 主分类号 B65B5/10
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